彭博社刊文称中国通过分包生产商向 SuperMicro 主板内植入额外芯片以达到攻击目的
https://www.bloomberg.com/news/features/2018-10-04/the-big-hack-how-china-used-a-tiny-chip-to-infiltrate-america-s-top-companies
个人评论:要国内几年前就有能力做出来这种东西国内半导体业用得着搞得今天这地步
https://www.bloomberg.com/news/features/2018-10-04/the-big-hack-how-china-used-a-tiny-chip-to-infiltrate-america-s-top-companies
个人评论:要国内几年前就有能力做出来这种东西国内半导体业用得着搞得今天这地步